As electronic devices evolve toward lighter, thinner, and higher performance, electronic components are continuously advancing toward miniaturization. However, the “millimeter-level or even micrometer-level” machining demands brought by miniaturization pose challenges for traditional grinding equipment, such as insufficient precision and susceptibility to component damage. The ultra-precision double disc grinding machine developed by Rushan Shuangxing Machine Tool Manufacturing Co., Ltd. achieves breakthroughs through technological innovation, providing a reliable solution for the miniaturized machining of electronic components.
The core challenges in micro-processing electronic components center on two aspects: first, extremely small dimensions—such as certain chip accessories with diameters as small as 2-3 millimeters—making it difficult for traditional grinding machines to precisely control the grinding range; second, special materials like ceramics and sapphire, which are brittle and prone to chipping or cracking during micro-processing, making it hard to ensure high yield rates. To address these challenges, Rushan Shuangxing's ultra-precision double disc grinding machine employs a “nanometer-level precision control system.” By integrating high-precision linear encoders and servo motors, it limits processing errors to within 0.0005 millimeters—equivalent to 1/140th the diameter of a human hair—precisely meeting the demands of micro-component machining.
Simultaneously, the equipment innovatively develops a “flexible grinding process.” Tailored to the characteristics of brittle materials, it automatically adjusts grinding pressure and feed rate to prevent stress damage during processing. Taking the micro ceramic base in mobile phone camera modules as an example, after processing with this grinding machine, the chipping rate drops from 8% with traditional equipment to below 0.5%, significantly improving yield rates. Currently, this equipment serves electronics manufacturers like Foxconn for mass production of micro-connectors, sensors, and other components.
Furthermore, to accommodate the electronics industry's “high-mix, low-volume” production model, the grinder features an upgraded “rapid changeover system.” Switching processing molds and adjusting parameters takes only 3 minutes—an 80% reduction in changeover time compared to traditional equipment—meeting enterprises' flexible production demands. In terms of intelligence, the equipment integrates real-time machining data monitoring, automatically recording grinding parameters for each batch of dimensional components. This facilitates quality traceability and process optimization.
From technological breakthrough to practical application, Rushan Shuangxing's ultra-precision double disc grinding machine not only solves the challenge of grinding miniaturized electronic components but also advances machining precision standards across the electronics manufacturing industry. It provides robust support for the R&D and production of high-end electronic devices.