Traditionally, double disc grinding machines have been closely associated with metal component processing. However, with rapid technological advancements, this precision machining technology has successfully transcended conventional boundaries, demonstrating exceptional application value in high-end materials such as semiconductors, ceramics, and cemented carbides.
In semiconductor manufacturing, double disc grinding machines play a critical role. They efficiently thin and planarize wafer substrates like silicon wafers and gallium arsenide. Through precise synchronized double-sided grinding, they rapidly remove excess material, achieving exceptional thickness accuracy and parallelism. This process also establishes an optimal surface foundation for subsequent chemical mechanical planarization (CMP) steps—critical for chip performance and yield rates.
When processing high-hardness, high-brittleness materials like ceramics and cemented carbides, conventional methods are prone to chipping and micro-cracks. By employing diamond or cubic boron nitride (CBN) super-hard abrasive wheels combined with optimized process parameters, double-sided grinders achieve precision plastic-range grinding. This process removes material in the form of fine powder rather than large-particle chipping, effectively suppressing machining defects to achieve flawless edge quality and optical-grade surface finish.
Evidently, double disc grinding machines have successfully transitioned from traditional mechanical manufacturing into high-tech industries demanding stringent machining precision. Leveraging their unique advantages in high accuracy, consistency, and handling difficult-to-machine materials, they have become a pivotal force driving the advancement of modern manufacturing.