As a highly efficient and precise planar processing machine, the double disc grinding machine has a wide range of applicable materials, covering both metallic and non-metallic materials. The specific application depends on the compatibility between material properties and machine process parameters.
In metal material processing, ferrous metals are the primary application targets for double-sided grinding machines. Carbon structural steels (such as Q235 and 45# steel) have moderate hardness (HB 180–240), making them less prone to tool adhesion during grinding. They are commonly used for rough or semi-finished processing of mechanical parts, such as gear blanks, bearing rings, etc. Double-sided grinding can quickly remove oxide scale after forging or hot rolling, ensuring parallelism between the two surfaces within 0.01 mm. Alloy structural steel (such as 20CrMnTi, 40Cr) contains alloy elements (Cr, Mn, etc.), resulting in increased hardness (HB220–280). Grinding requires the use of ceramic or CBN grinding wheels (grit size #80–#120). Typical applications include precision end-face machining of automotive transmission gears, ensuring end-face flatness ≤0.005 mm after heat treatment.
Stainless steel (e.g., 304, 316L) has high plasticity and poor thermal conductivity (thermal conductivity is approximately one-third that of carbon steel), making it prone to grinding heat and wheel clogging during grinding. A high-pressure cooling system (coolant pressure ≥0.8 MPa) and open-pore wheels (structure number 10–12) must be used. Commonly used for processing medical devices (surgical instrument housings) and food machinery (stirring shaft end faces), double-end face grinding can eliminate deformation after welding and ensure a surface roughness of Ra ≤ 0.8 μm. Cast iron (such as HT300, ductile iron) has good grinding performance due to the lubricating effect of graphite. but care must be taken to prevent grinding wheel wear caused by graphite shedding. Resin-bonded grinding wheels ( concentration) are recommended, typically used for engine cylinder block end face processing, capable of removing 0.5 mm of material in a single pass, with efficiency three times that of single-end grinding machines.
Among non-ferrous metals, aluminum alloys (such as 6061, 7075) have low hardness (HB 60–100) and a high thermal expansion coefficient (23.6 × 10⁻⁶/°C), so ultra-soft grinding wheels (hardness J–K grade) and low-temperature grinding (grinding zone temperature ≤50°C) must be used to prevent material adhesion and thermal deformation. Aluminum alloy frame end face machining commonly used in the aerospace field can control thickness tolerances to ±0.003 mm through double-end grinding. Copper alloys (such as brass H62 and bronze QSn6.5–0.1) have high plasticity and are prone to “copper growth” during grinding, so sharp grinding wheels (grit size #150–#200) and extreme pressure cutting fluids must be used. Typically applied to the end face machining of copper plates for electronic connectors, achieving a surface roughness of Ra0.4μm.
In non-metallic material processing, ceramics (such as Al₂O₃, ZrO₂) have high hardness (HV1200–1800) and brittleness, so diamond grinding wheels (grit size #200–#500) and slow feed grinding (feed rate ≤50 mm/min) must be used to prevent chipping. Commonly used for precision end face machining of ceramic seals and electronic substrates, with parallelism controllable within 0.002 mm. For hard alloys (e.g., YT15, YG8) due to their high hardness (HRA89–92) and high wear resistance, ultra-fine-grain diamond grinding wheels (D50–D30) must be used, employing a multi-step grinding process (rough grinding allowance 0.3 mm, finish grinding allowance 0.05 mm). This is typically applied to the end face machining of carbide cutting tools to ensure consistent edge sharpness.
Additionally, composite materials (such as carbon fiber-reinforced plastic CFRP) have low interlaminar bond strength and are prone to delamination during grinding, so specialized slotted grinding wheels (slot width 0.5 mm, slot spacing 2 mm) and low grinding pressure (≤0.5 MPa) are required, commonly used for end face machining of aerospace components. Semiconductor materials (such as silicon wafers and germanium wafers) require mirror grinding in an ultra-clean environment (ISO Class 5) using resin-bonded diamond grinding wheels (grit size #1000–#2000), achieving a surface roughness of Ra ≤ 0.05 μm to meet the high-precision requirements of chip packaging.
The adaptability of double disc grinding machine to materials fundamentally depends on the matching design of the grinding wheel abrasive (alumina, CBN, diamond), binder (resin, ceramic, metal), and cooling system. In practical applications, processing parameters must be optimized based on material properties such as hardness, thermal conductivity, and wear resistance through grinding process trials (e.g., grinding wheel linear speed of 15–35 m/s, grinding depth of 0.01–0.1 mm) to ensure optimal alignment between equipment performance and material characteristics, thereby achieving efficient and precise processing.